Sawatec Leaflet_SMD-200 顯影機

Sawatec Leaflet_SMD-200 顯影機:

外露光刻膠的研制是光刻膠研制過程中最關(guān)鍵的步驟之一，因此對研制過程及其參數(shù)(溫度、研制時間等)的選擇要特別注意。在噴淋顯影過程中，對每個基板分別進行單獨顯影，并在暴露區(qū)域連續(xù)噴淋新顯影劑或蝕刻劑，以防止顯影劑飽和。

SAWATEC開發(fā)人員可用于水坑或噴霧開發(fā)，在此過程中，根據(jù)應(yīng)用程序的技術(shù)和經(jīng)濟標準選擇流程。與水坑開發(fā)相比，噴霧開發(fā)的優(yōu)點是可以釋放非常小的精細結(jié)構(gòu)。水坑法的優(yōu)點是，當襯底有較深的結(jié)構(gòu)時，顯著較少的顯影液需要和較好的結(jié)果。

SMD系列用于清洗和顯影8英寸(200mm)以下的晶圓或6英寸(150x150mm)以下的基板。過程——室工作Ø212毫米。

由SAWATEC公司開發(fā)的SMD具有良好的工藝性能、低的化學(xué)消耗和可靠的重復(fù)性，甚至具有較厚的光刻膠層。由于操作簡便，易于清洗，這些儀器是理想的適合于實驗室，研發(fā)，研究所和試點項目。

該儀器可作為臺式或移動式機柜。

功能(基本配置)

FEATURES (BASIC CONFIGURATION)

Up to 50 programmes with 24 segments each can be programmed
Quick start function for repeat processes
User-friendly process configuration with touch screen panel
Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
Electrical driven spray arm, with dynamic or static function
Developer line and media tank (2 litre) for one developer included
Nozzle for DI-water-rinse and N2 drying on the spray arm
Nozzles in the process bowl for the backside rinse
Control elements for dosing of the compressed air and vacuum
Rotational direction can be selected (CW, CCW)
Manual loading and unloading of the substrates

Mechanical substrate fixation

Acoustic signal when the process has finished

PERFORMANCE DATA

§ Speed range: 0 to 3’000rpm +/-1rpm 1)

Speed acceleration: 0 to 3’000rpm in 0.3 seconds 1)
Process time up to 2376 seconds
Developer spray time 99 seconds/segment
Speed of the spray arm 10 to 200mm/seconds
Rinse and N2 drying 99 seconds/segment
Heatable process hood up to 50°C
Spray nozzle made of PEEK 0,8mm

ADDITIONAL FUNCTIONS (OPTIONS)

Additional developer lines (up to 4 developer lines possible)
Start/stop foot switch for ease of operation (cable length 1.8m)
Separation unit for media exhaust (tank and laboratory equipment)
Developer tank heating system (2 litre)
Spray nozzle made of PEEK (0,3 / 0,5mm)
Nozzle for puddle developing